IC cutting force testing machine

Chip Push-Pull Tester IC Weld Strength Tester IC Push Pull Tester Pull Shear Tester Shear Pull Tester Internal Wire Bond Pull Force and Chip Shear Test Performance Superior to dage4000

Multi-functional push-pull testing machine: Using AUTO-RANGE technology and VPM vertical positioning technology, the test sensor adopts automatic range design with resolution up to 0.0001g
Push-pull testing machine (multi-functional shear tester) is a special dynamic test instrument for the field of microelectronics packaging and PCBA electronic assembly manufacturing and failure analysis. It is an important instrument and equipment in the field of microelectronics and electronic manufacturing. The device is tested quickly, accurately, widely applied, and has high testing accuracy. It is suitable for semiconductor IC package testing, LED package testing, optoelectronic device packaging testing, PCBA electronic assembly testing, automotive electronics, aerospace, military and so on. It can also be used in various areas of electronic analysis and research unit failure analysis as well as teaching and research in various institutions. The device achieves world-class standards regardless of test accuracy, repeatability, handling, and design.

Applications include: wire pull, ball shear, tweezer pul, cold bump pull and more specialized stud pull and more. Push-pull testing system is suitable for testing aluminum and aluminum wire bonding in various semiconductor packaging forms; COB packaging, optoelectronics, LED, SMT assembly, original and substrate adhesion testing;

Push-pull testing machine features:
1, Weight: 65 kg
2, Appearance: width 620 mm × length 520 mm × height 700 mm
3, the table X direction and Y direction of the large travel 60 mm; resolution of 0.25 micrometers; speed 2.5 mm / sec; can withstand strong 200 kg; Z direction 70 mm;
Resolution 1 micron; speed 10 mm/s during exercise; can withstand 100 kg
4, the measurement range: 100 g / 5000 g/10 kg / 100 kg
5, measurement accuracy: 0.1%
6, measurement standards: identification standards

Push-pull tester function:
1, can achieve multi-functional push-pull test; 2, any combination can achieve a variety of functional tests;
3, to meet a single test module; 4, innovative mechanical design mode;
5, powerful data processing functions; 6, simple operation mode, convenient and effective.

Push-pull testing machine application:
1, can perform a variety of push pull testing: gold ball, solder ball, chip, wire, welding, etc.
2, large test load of 500kg 3, independent module can be freely added to any test module:
4, powerful analysis software for statistics, breaking analysis, QC statements and other functions
5. The X and Z axes can be moved at the same time so that the tension angle remains the same 6. Stylized automatic test function

Tensile test, gold/aluminum wire tension test, non-destructive tension test (non-destructive rake)
·Aluminum belt tension test ·Non-vertical (any angle) pull test ·Gold/aluminum wire tension test ·Clamp component pull test ·Film/coating/chip/component vertical pull test ·Pin fatigue test

Under pressure test (Z axis vertical thrust) · Under pressure test (Z axis vertical thrust)
· Non-destructive testing · Bending and compression test · Pin fatigue test

Thrust test, push gold/aluminum wire test, non-destructive thrust test (non-destructive rake)
· Tin/Gold Ball Thrust Test · Solder Ball Whole Column Thrust Test · Solder Ball Matrix Thrust Test · Chip Thrust Test · Aluminium Strip Thrust Test

Peel Test · Aluminum Strip Test · Non-destructive Tensile Test (Non-destructive Lac)

Rolling test, wafer pressure test, ceramic pressure test

Distance measurement, Arc height measurement, 3D height map, Random distance measurement, Probe height measurement, 3-axis distance measurement

Test Methods:
1. Gold wire and aluminum wire bond tension test. 2. Gold wire, aluminum wire solder joint shear test.
3. Wafer Welding (Solid Crystal) Shear Test. 4. PCB Mount Resistor, Capacitor Component Shear Test.
5. BGA ball shear test. 6. BGA ball group push test. 7. BGA placement thrust test.
8. QFP Solder Joint Shear Test.

Warmly congratulate M FM push pull tester (welding strength tester) successfully won the bid of Weifang Semiconductor Lighting Product Testing Center and Changzhou Semiconductor Lighting Application Technology Research Institute and Semiconductor Lighting Joint Innovation Laboratory Hexun Semiconductor Xinke Magnetic Power Dongguan Yushchenko etc.

Provide 24-hour service plan and custom sample solution. Provide other brand supplies dage4000 push pull hook, dage4000 push knife, dage4000 correction weights and other shear force modules. High-quality large customers can provide new aircraft trial service.

Recommendation No. 2: The device tube fillet welding tensile test after placement.
Tensile test module 10 kilogram force, suitable for tensile test of welded pipe not exceeding 10 kilograms.
Thrust test module 100 kg force, suitable for thrust test not exceeding 100 kilograms.