Abstract The heat transfer model of low temperature bonded abrasive polishing silicon wafer is analyzed. The heat transfer process is simulated by finite element software ANSYS. The isothermal map of the frozen abrasive tool at different polishing times and the melting thickness of the working area are obtained. . And under the same process parameters, polishing experiments were carried out to verify the results of finite element numerical analysis. The analysis and simulation results show that the grinding heat is not the main reason for the melting of the frozen abrasives when the ambient temperature is 20oC. The convective heat transfer of the surrounding air has a great influence on the temperature field, and the temperature rise rate of the abrasive tools is fast and slow. The melting rate of the polished area is relatively stable. Using this finite element model, the influence of polishing time, ambient temperature and other parameters on the temperature field can be analyzed, which provides theoretical guidance for the study of temperature field of low temperature bonded abrasive polishing silicon wafer. (Diamond and Abrasives Engineering, 2009, Issue 1)
Abstract Heat transfer model was analyzed for polishing with ice fixed abrasives in this paper. With ANSYS finite element, the value of temperature fields for polishing was simulated. The temperature contour map of temperature field and the melting thickness values ​​of working area of ​​ice fixed abrasive tool were obtained. Polishing experiments were conducted with the same technological parameters. Compared with polishing experiments, the simulation result of FEM model was proved to be right. According to the simulation result of FEM, we can get the main reason of melting of working area in ice fixed abrasive tool which is not grinding heat but air convection surrounding the tool at 20oC ambient. The temperature increment followed a rule of 6rSt fast then slow. Melting velocity curve of working area of ​​ice fixed abrasive tool was steady and change little. Other technical parameters (for example ambient temperature or polishing time) can be analyzed in advance by the FEM model, and provide theoretical guidance for research of temperature field of polishing with ice fixed abrasives
Abstract Heat transfer model was analyzed for polishing with ice fixed abrasives in this paper. With ANSYS finite element, the value of temperature fields for polishing was simulated. The temperature contour map of temperature field and the melting thickness values ​​of working area of ​​ice fixed abrasive tool were obtained. Polishing experiments were conducted with the same technological parameters. Compared with polishing experiments, the simulation result of FEM model was proved to be right. According to the simulation result of FEM, we can get the main reason of melting of working area in ice fixed abrasive tool which is not grinding heat but air convection surrounding the tool at 20oC ambient. The temperature increment followed a rule of 6rSt fast then slow. Melting velocity curve of working area of ​​ice fixed abrasive tool was steady and change little. Other technical parameters (for example ambient temperature or polishing time) can be analyzed in advance by the FEM model, and provide theoretical guidance for research of temperature field of polishing with ice fixed abrasives
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