Huifeng travels to the US to attend the 2011 Diamond INTERTECH Conference

From May 2nd to 4th, 2011, Huifeng participated in the INTERTECH conference held by the Diamond Association of the United States for two years. Diamond, CBN and tools. Participants from the conference were from European, Asian, American and local diamond companies and university professors. The conference focused on the current situation and future development trends of the super-hard materials industry, and detailed issues such as the manufacture, use and technological innovation of various diamond tools.
Participated in this meeting to make Huifeng Company   Broaden your horizons and see the future development trend in a complex market environment, for Huifeng Company   The future development has a very good boosting effect; for the meeting Huifeng Company   Arranged a product booth, during which a number of new and old customers came to Huifeng Company   Booth visit, to Huifeng Company   Opening up the international market has played a big role in promoting.
 

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